Why partner with COFAN-USA?
- 1. Technology
- 2. Quality
- 3. Responsiveness
- 4. Delivery
- 5. Cost
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SMTA & Final Assembly(OEM)
With our strength of MCPCB, heat sink, assembly and full function design capabilities,
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Manufacturer of PCB's and MCPCB's.
Home > Products > Quality
- Quality, Efficiency and Service
- Strictly obey the legislations and regulations for pollution prevention.
- Continually improve the processes for saving the resources usage.
- Progressively manufacture the environment-protected products for the benefits of human society
Health and Safety Policy
- Strictly obey the legislations and regulations for the employee health and safety.
- Continually create the health and safety working environment.
- Progressively prevent the potential risk of endangering the health and safety.
- 100% visual inspection and electrical test
- Test data
- Certification - ISO 9001
- XRF test data
- Solderability test
- Impedance modelling/testing
|1. IQC||Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products|
|2. IPQC||In-process quality control, Every process on line sampling inspection|
|3. Chemical analysis||Chemical analysis to control on line chemical solution within control range|
|4. Physical Laboratory||To do reliability test and outgoing inspection items|
|5. Micro-section||To analysis defects, every layer structure thickness, solder mask thickness, surface and PTH copper thickness|
|6. Black Light inspection||To analysis the PTH hole copper coverage before Panel copper plating|
|7. Lamination thickness measurement||To control the product thickness quality even distribution and thickness tolerance under control|
|8. L/S measurement control by 3D||To control the products after Pattern plating within the design spec. ( Line width and Space width)|
|9. CMI measure copper thickness||CMI help to measuring the PTH hole copper thickness and no need to damage the board by micro-section|
|10. Impedance measurement||For measuring Impedance control products ( Single strip, Differential …)|
|11. Peel strength test||Testing Solder Mask adhesive|
|12. X-ray monitor multi layer drilling||It control inner and outer layer registration|
|13. Hole AOI||To check hole location compare with Gerber design location accurace|
|14. XRF measure Nickel & Gold thickness||To measuring surface finishing metal thickness|
|15. Hi-Pot test||To checking dielectric insulation capability|
|16. 100% O/S test||To checking circuit normal function as design circuit|
|17. Hole counter||To check missing hole, hole size out spec., no excess holes|
|△||DSC(Eternal)||△ Tg < 5℃||Once / month||Assure the lamination condition is OK|
|Surface insulation||SIR & Chamber||1.0X 1010 Ω Min||2 Pcs / month||Assure the raw material condition is OK|
|Solderability||Solder Pot||ANSI / STD-J-003||Once / Shipping Lot||Assure the SMT wettability|
|Thermal Stress||Solder Pot||IPC-6012B||3Pcs / week
|Assure the via hole copper reliability|
|S/M Abrasion Test||6H Pencil||IPC-SM-840D||3Pcs / week||Assure the S/M curing complete & quality|
|Via Hole THK &
|Once / Shipping Lot||Assure the quality of lamination and plating process|
|Impedance||Polar||Customer Spec.||Once / Shipping Lot||Assure the quality of Impedance|
|High Voltage||Hi-Pot||Customer Spec.||Once / Shipping Lot||Assure the quality of insulation|