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  • 2. Quality
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SMTA & Final Assembly(OEM)

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Aluminum Board Fabrication & Concurrent Engineering

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Manufacturer of PCB's and MCPCB's.


Home > Products > Quality

Quality Policy

  • Quality, Efficiency and Service

Environment Policy

  • Strictly obey the legislations and regulations for pollution prevention.
  • Continually improve the processes for saving the resources usage.
  • Progressively manufacture the environment-protected products for the benefits of human society

Health and Safety Policy

  • Strictly obey the legislations and regulations for the employee health and safety.
  • Continually create the health and safety working environment.
  • Progressively prevent the potential risk of endangering the health and safety.


  • 100% visual inspection and electrical test
  • Test data
  • IPC
  • Certification - ISO 9001
  • XRF test data
  • Solderability test
  • Impedance modelling/testing
Items Descriptions
1. IQC Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products
2. IPQC In-process quality control, Every process on line sampling inspection
3. Chemical analysis Chemical analysis to control on line chemical solution within control range
4. Physical Laboratory To do reliability test and outgoing inspection items
5. Micro-section To analysis defects, every layer structure thickness, solder mask thickness, surface and PTH copper thickness
6. Black Light inspection To analysis the PTH hole copper coverage before Panel copper plating
7. Lamination thickness measurement To control the product thickness quality even distribution and thickness tolerance under control
8. L/S measurement control by 3D To control the products after Pattern plating within the design spec. ( Line width and Space width)
9. CMI measure copper thickness CMI help to measuring the PTH hole copper thickness and no need to damage the board by micro-section
10. Impedance measurement For measuring Impedance control products ( Single strip, Differential …)
11. Peel strength test Testing Solder Mask adhesive
12. X-ray monitor multi layer drilling It control inner and outer layer registration
13. Hole AOI To check hole location compare with Gerber design location accurace
14. XRF measure Nickel & Gold thickness To measuring surface finishing metal thickness
15. Hi-Pot test To checking dielectric insulation capability
16. 100% O/S test To checking circuit normal function as design circuit
17. Hole counter To check missing hole, hole size out spec., no excess holes
Reliability Test
Check Items Equipment Specification Frequency Purpose
DSC(Eternal) △ Tg < 5℃ Once / month Assure the lamination condition is OK
Surface insulation SIR & Chamber 1.0X 1010 Ω Min 2 Pcs / month Assure the raw material condition is OK
Solderability Solder Pot ANSI / STD-J-003 Once / Shipping Lot Assure the SMT wettability
Thermal Stress Solder Pot IPC-6012B 3Pcs / week
Important products
Assure the via hole copper reliability
S/M Abrasion Test 6H Pencil IPC-SM-840D 3Pcs / week Assure the S/M curing complete & quality
Via Hole THK &
Dielectric THK
Microsection &
500X Microscope
IPC-6012B &
Customer spec.
Once / Shipping Lot Assure the quality of lamination and plating process
Impedance Polar Customer Spec. Once / Shipping Lot Assure the quality of Impedance
High Voltage Hi-Pot Customer Spec. Once / Shipping Lot Assure the quality of insulation
Download COFAN-USA Certifications