MCPCBs
MCPCBs (Metal-Core Printed Circuit Boards)
What is an MCPCB?
Metal Core PCBs are engineered to merge a circuit board with a heat sink for better heat dissipation.
MCPCBs are made with three main layers:
1) An aluminum or copper base (heatsink),
2) A dielectric pre-preg insulator
3) Copper foil on top
LEDs are assembled at the top with the heat transferred across the surface of the MCPCB down to the attached heatsink. Aluminum is recommended for most applications due to its cost-effectiveness, weight, and thermal dissipation but copper offers the best thermal dissipation.
Why use MCPCBs?
MCPCBs offer 10 times the thermal conductivity of a standard FR-4 PCB, which means better heat dissipation, brighter lumen output, and a longer lasting product.
MCPCBs are used in high-powered LED lighting applications in many industries worldwide. Notable industries that use MCPCBs include automotive, lighting (UV, street, stage), medical, and military.
We can customize MCPCBs for your specific needs; for more information, please see PCB Capabilities.
Introducing COFAN's MCPCB
Advantages
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Longer component life (components operate at lower temperatures)
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Durable
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Flatness maintained in all 3 layers
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High heat dissipation
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High density of components
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Reduced PCB size / small footprint
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Higher watt density
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Less hardware (topical heatsinks, screws, clips, etc)
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Lower manufacturing cost
Services Provided
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Prototyping with short lead times
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Complete thermal analysis and design
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Custom heatsinks/designs
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Stocking program available
APPLICATIONS
As LED technology advances, manufacturers are creating brighter, more powerful lights that require better thermal management. Whether it's street/city lighting or military lighting, you can rely on our MCPCBs to make your products last.
APPLICATIONS
Automotive
OLED Displays
Street Lighting
Motor Control
Medical
Military
For extreme heat dissipation, please see our patented Super Pillar.
Our unique and patented Super Pillar is proven to be 100x more effective at heat dissipation than conventional MCPCBs.
