FR-4 PCBs
FR-4 PCBs
Most people don't realize that everything is controlled with a PCB. Whether it's your mouse, your keyboard, your phone, your TV, or your router, electronics are dependent on PCBs.
FR-4 is the material upon which the vast majority of PCBs are made. FR-4 PCBs are seen as the standard PCB because of its cost-effectiveness. For applications that don’t produce extreme heat, FR-4 PCBs are your tried-and-true solution.
FR-4 copper-clad sheets are fabricated with circuitry etched into copper layers and become more complex as more layers are added. A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel, commonly referred to as “copper clad laminates.”
For more information on FR-4 PCB capabilities and how we can customize these boards for you, please see PCB Capabilities.
Process
Item
Normal SPEC
Special SPEC
01/
Material
150℃ to 180℃
Layer count
16L
20L
02/
Mask
Color
Green / blue / Red / Black / White / Golden / Clear
03/
Silkscreen
Color
White / Black / Red / Yellow
04/
Testing
1. Open / Short Testing Spacing
2. Open / Short Board Size
3. Open / Short Testing Condition
4. Netlist Test
Dedicate: 6ml
Fly probe Spacing: 4mil (Smd Pitch: 10 mil)
Dedicate: 600x400mm(max)
Fly probe: 640x450mm(max)
Dedicate: 250V / 50Ω / 2MΩ
Fly probe: 250V / 50Ω / 10MΩ
min / max: 1MΩ ~ 20MΩ
1). Measure Machine: POLAR
2). Tolerance: ±10%
3). design: Single End / Differential ±10%
4). Testing Pitch: 0.254mm
Tolerance 5%
05/
Finish Type
HASL
Carbon Ink
Imm gold
Hard gold
Imm Tin
Leadfree HAL
Imm Silver
Imm Gold+HASL
Imm Gold+ENTEK. Carbon+ENTEK
Imm gold+G / F(3~30μ)
Partial Hard Gold
Partial Imm Gold
Imm Gold + SMOBC
Density
Thickness Tolerance
Thickness (Minimum / Maximum)
QFP
Minimum Solder mask Web
Minimum Prepreg Fill
Minimum Line/Spacing - Internal 1/2 oz
Minimum Line/Spacing - External 1/2 oz
Minimum Drilled Hole Size
Minimum Core Thickness
Layer to Layer Registration
Land Size (Diameter over Drill)
BGA
Aspect Ratio - Line Card
+/- 8
7 / 300
0.5 mm
0.005
.0025
.004
.004
.008
.004
+/- .005
.010
.5 mm
12:01
+/- 6
5 / 440
.4mm
.004
.002
.003 1/3 oz
.003 1/3 oz
.006
.003
+/- .003
.008
.4mm
14:01
Title
Standard
Advanced & Development
HDI VIAS
Microvia Aspect Ratio
Variable Depth Laser Via (Depth / Diameter)
Minimum Laser Via (Drill / Capture Pad)
BBV Mechanical Drill
.5:1
.004/.006
.006/.016
.010
.004/.005
.005/.014
.008
Title
Standard
Advanced & Development
Impedance Control
28 - 260Ohms
50 - 150 Ohms
+/-10%
+/-10%
+/-7%
+/-7%
Title
Standard
Advanced & Development
Copper Weights
Min Outer Base Copper - plated layers
Max Outer Base Copper - plated layers
Max Inner Copper Foil - non plated layers
Min Inner Copper Foil - non plated layers
1/2 oz
5 oz
4 oz
1/4 oz
1/4 oz
5 oz
5 oz
1/4 oz
Title
Standard
Advanced & Development
