RIGID & FLEX PCBs

Twist it, bend it, and shape it — COFAN’s flexible PCBs are able to bend, but not break that’s necessary for a growing segment of electronics (like bendable TVs and phones). It isn’t all about being flexible though, as products need to be flexible in one area, but rigid in the next. COFAN offers rigid-flex for when you need just the right amount of flexibility and rigidity.

Fabrication Capabilities

Item
Standard
Layer to Layer Registration Tolerance
+/- 75 um (for multilayer mass production)
Layer Count
Standard: 1 – 4 layers (Capabilities: 1 - 6 layers)
Material
Polyimide (variety of brands available)
Plating finishes
Copper, Gold, Nickel, Silver, Tin, Tin-lead
Minimum Drilled Hole
100um(Finished)
X-Y inspection tolerance
± 75 um
Minimum Line Width/ Spacing
Standard: 100 um Capabilities: 40.6 um (1/3-1/2 OZ conductor)
Drilling/punching tolerance
± 50~75 um
Shielding
RFI / EMI provides 70(+) DB isolation from 50MHz to 12 GHz
Controlled impedance
40 ohms to 100 ohms
Aspect Ratio
9:1
Max Panel Sizes
Single Sided: 500 mmX 2000 mm Roll to roll is available for single sided Double or Multilayer: 480mmX 480mm

FPC Design Guidelines

Button Plate Trace/Space and Thickness

Design Rule Parameter
Drawing/Pictures
Production Zero Base (µm)
Leading Edge (µm)
Min. Space width between Traces ( >= 12um Cu Foil)
FPC DR 1_Trace Width & Space
50
40
Min. Space width between Traces ( >=9um Cu Foil)
FPC DR 1_Trace Width & Space
30
25
Min. Space width between Traces ( <= 18um Cu Foil)
FPC DR 1_Trace Width & Space
60
50
Max. Plated button finished thickness (above base copper)
FPC DR_Button Ht
20
20
Min. Trace width ( >= 9um Cu Foil)
FPC DR 1_Trace Width & Space
30
40
Min. Trace width ( >= 12um Cu Foil)
FPC DR 1_Trace Width & Space
50
50

Plated Through Hole (PTH) 

Design Rule Parameter
Drawing/Pictures
Production Zero Base (µm)
Leading Edge (µm)
Min. Mechanical Drilled PTH Diameter
FPC DR_PTH
150
100
Min. Laser Drilled Via Pad Size (Panel Plate)
FPC DR_PTH
450
350
Min. Laser Drilled Via Pad Size (Button Plate)
FPC DR_PTH
400
300
Min. Laser Drilled PTH Diameter
FPC DR_PTH
75
75
Min. Mechanical Drilled Via Pad Size (Panel Plate)
FPC DR_PTH
300
275
Min. Mechanical Drilled Via Pad Size (Button Plate)
225
175 (LDI)

Copper to Copper / Holes / Slot / Bds Outline Clearance

Design Rule Parameter
Drawing / Pictures
Production Zero Base (µm)
Leading Edge (µm)
Min. Trace/Ground/Via Pad to SMD Component Pad Edge (Photoimaged Mask)
FPC DR_Cu/SMD Pad
100
Min. Copper Edge to outline Edge
FPC DR_ Cu to Bds Outline
200
150
Min. layer to layer registration tolerance - 3 to 6 layers
FPC DR_ Lyr_lyr registration
75
Min. layer to layer registration tolerance - 2 layers
FPC DR_ Lyr_lyr registration
50
30
Min. space from via pads/trace/grounds to ground (I/L <=18um Cu Foil)
FPC DR_ T-V_V-V_VTG-G
75
Min. space from via pads/trace/grounds to ground (O/L <=18um Cu Foil, button plated)
FPC DR_ T-V_V-V_VTG-G
75
Min. Copper edge to NPTH or Non-Plated Slot Edge
FPC DR_ Cu/Bds edge to NPTH or non-plated slot
200
150
Min. Via Captured Pad to Via Captured Pad
FPC DR_ T-V_V-V_VTG-G
100
75
Min. Non-plated slot or NPTH edge to outline edge
FPC DR_ Cu/Bds edge to NPTH or non-plated slot
200
150
Min. trace to via captured pad ( I/L <= 18um Cu Foil)
FPC DR_ T-V_V-V_VTG-G
100
75
Min. trace to via captured pad ( O/L <= 18um Cu Foil, button plated)
FPC DR_ T-V_V-V_VTG-G
100
Min. trace to via captured pad ( O/L finished thickness <18um / >= 40um)
FPC DR_ T-V_V-V_VTG-G
100
75
Min. SMD Component Pad to SMD Component Pad (Coverlay)
600
400
Min. SMD Component Pad to SMD Component Pad (Photoimaged Mask)
FPC DR_NSMD Space
200
150
Min. Trace/Ground/Via Pad To NSMD Component Pad Edge (Coverlay)
FPC DR_NSMD Space
150
Min. Trace/Ground/Via Pad To NSMD Component Pad Edge (Photoimaged Mask)
FPC DR_NSMD Space
100
Min. Trace/Ground/Via Pad to SMD Component Pad Edge (Coverlay)
FPC DR_Cu/SMD Pad
200

Soldermask / Coverlay / Stiffener

Design Rule Parameter
Drawing / Pictures
Production Zero Base (µm)
Min. Space Between Soldermask Edge to Component pad edge
FPC DR_ SM/CV & Tolerance
50
Min. Stiffener edge extention beyond all supported Cu pad edge
FPC DR 82
500
Min. Stiffener to Stiffener Gap
FPC_DR80
1500
Min. EMI Shielding film edge to Component Pad edge
FPC DR 39_40
500
EMI shielding film placement tolerance
FPC DR 39_40
±300
Min. Stiffener Edge to Start of Bend
FPC_DR80
500
Min. Stiffener Edge to Airgap edge
FPC_DR80
1000
Min. Coverlay Width (Dam)
FPC DR_ SM/CV & Tolerance
300
Min. Space Soldermask to NPTH or Non-Plated Slot
FPC DR_ SM/CV & Tolerance
75
Min. Soldermask Width (Dam)
FPC DR_ SM/CV & Tolerance
100
Coverlay to outerlayer pattern alignment Tolerance
FPC DR_ SM/CV & Tolerance
±150
Min. Space Coverlay to NPTH or Non-Plated Slot
FPC DR_ SM/CV & Tolerance
250
Soldermask to outerlayer pattern alignment Tolerance
FPC DR_ SM/CV & Tolerance
±50
Max Coverlay opening size Tolerance (Including the adhesive flow)
FPC DR_ SM/CV & Tolerance
130
Minimum coverlay opening size
FPC DR_ SM/CV & Tolerance
Stiffener placement tolerance
FPC_DR80
±300
Min. Space Between Coverlay Edge to Component pad edge
FPC DR_ SM/CV & Tolerance
150
Minimum soldermask opening size
FPC DR_ SM/CV & Tolerance
75

Tooling for Profile

Design Rule Parameter
Drawing / Pictures
Production Zero Base (µm)
Leading Edge (µm)
Outline Tolerance
FPC DR_ FPC outline
±100
±50
Max. Slot Length (# x Width)?
FPC DR_Slot Width/Length
6 times
Min. Slot Width
FPC DR_Slot Width/Length
500
Hole / Slot Edge to Outline Tolerance
FPC DR_ FPC outline
±80
±50
Min. Hole / Slot Edge to Outline Distance
FPC DR_ FPC outline
500
Hole / Slot to Hole / Slot tolerance
FPC DR_ FPC outline
80
Min. Hole / Slot edge to Hole / Slot edge distance
FPC DR_ FPC outline
1000
Punched Hole / Slot Position Tolerance
FPC DR_ FPC outline
80
Punched Hole Diameter tolerance
FPC DR_ FPC outline
±50
Min. Punched Hole Diameter
FPC DR_ FPC outline
500
Min. Inside Corner Radius
FPC DR_ FPC outline
400
Min. Outside Corner radius
FPC DR_ FPC outline
200

Others

Design Rule Parameter
Drawing / Pictures
Production Zero Base (µm)
Leading Edge (µm)
Min. total contact bond area (cm2) per cm2 of effective EMI Shielding Film surface
FPC DR 89_90
0.01/contact
Min. Cu Edge (exclude trace thru' airgap) to AirGap Edge -- > 4 layers
FPC DR_Cu/Air Gap Distance
1500
Min. Cu Edge (exclude trace thru' airgap) to AirGap Edge -- 2 to 4 layers
FPC DR_Cu/Air Gap Distance
1000
Min. Cu Edge (outside of Stiffener footprint) to Stiffener Edge
FPC DR 81
500
Min. AirGap Length for 5 to 6 Layers FPC
FPC DR_Air Gap Length
5000
Min. AirGap Length for 3 to 4 Layers FPC
FPC DR_Air Gap Length
3000
Min. single contact bond area (mm2) with EMI Shielding Film
FPC DR 89_90
1
Silkscreen alignment to board outline (tolerance)
±500
Max. Trace Width in Static bend region only (finished thickness >18um / <= 40um)
FPC DR_Trace Width at Bend
250
Max. Trace Width in bend region (<= 12um ED or RA Cu Foil)
FPC DR_Trace Width at Bend
100
Min. Ground opening edge to Outline edge
FPC DR_Circular/sloted gnd
200
Max. Ground to ground pitch
FPC DR_Circular/sloted gnd
700
Min. Ground to ground pitch
FPC DR_Circular/sloted gnd
625
Max. Ground opening diameter
FPC DR_Circular/sloted gnd
500
Min. Ground opening diameter
FPC DR_Circular/sloted gnd
200
Max. space width of Parallel trace ground
FPC DR_Circular/sloted gnd
200
Min. space width of Parallel trace ground
FPC DR_Circular/sloted gnd
125
Max. width of Parallel trace ground
FPC DR_Circular/sloted gnd
500
Min. width of Parallel trace ground
FPC DR_Circular/sloted gnd
200