COBs
COB (chip-on-board) mounts a chip directly onto the substrate. Depending on the substrate used, COB can also be called COG (chip-on-glass) and COF (chip-on-flex). Mainly used with LEDs, the benefits of COB are its small size, LED intensity, uniformity, and heat dissipation, leading to longer-lasting LEDs.
Intellectual Property
Reflective Pocket in PCB for LED Die Attach (COB)
Advantages
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Improve output efficiency of LED lighting
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Avoid photonic absorption and scattering over the pocket wall
Reflective MCPCB for LED Backlight (COB)
Advantages
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Improve LED light guide efficiency
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Avoid loss by surface reflection, absorption and scattering
MCPCB with Thermal Conductive Pillar (Non-COB)
Advantages
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Improve LED thermal dissipation
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Allow LED to work in extreme environmental conditions:
1) Climate - Arizona summer
2) Installation - limited space for thermal diffusion
Our COB manufacturing process consists of three steps:
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We mount or attach the die to the board or substrate.
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We connect the wires between die and substrate for thermosonic (Au or Cu) ball bending and ultrasonic (Al) wedge bending.
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We dispense chemical liquid (usually epoxy) over die and wires to protect against chemical and mechanical damage.
COBs offer better performance due to its small size and a reduction in connections and solder joints, limiting the resistance. COBs also reduce cost due to its size with higher reliability and better heat dissipation.
3-Pad COB
Light Bar Structural
UVA Products
