COBs
COB (chip-on-board) mounts a chip directly onto the substrate. Depending on the substrate used, COB can also be called COG (chip-on-glass) and COF (chip-on-flex). Mainly used with LEDs, the benefits of COB are its small size, LED intensity, uniformity, and heat dissipation, leading to longer-lasting LEDs.
Intellectual Property
Our COB manufacturing process consists of three steps:
-
We mount or attach the die to the board or substrate.
-
We connect the wires between die and substrate for thermosonic (Au or Cu) ball bending and ultrasonic (Al) wedge bending.
-
We dispense chemical liquid (usually epoxy) over die and wires to protect against chemical and mechanical damage.
COBs offer better performance due to its small size and a reduction in connections and solder joints, limiting the resistance. COBs also reduce cost due to its size with higher reliability and better heat dissipation.
3-Pad COB
Light Bar Structural
UVA Products