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At COFAN, we have very strict company policies and philosophies that we adhere to for not only make the best product possible, but also to ensure that we’re doing what’s right for the community, environment, and society.

Quality Policy​

Our quality policy is borne out of our philosophy to provide the best products. We ensure our products meet our high standards by doing multiple tests, including:​

  • Visual inspection and electrical test

  • Impedance modelling and test

  • Solderability test

  • XRF (X-ray fluorescence) test

  • IPC standard

  • ISO 9001 certified

Quality Policy

  • Quality, Efficiency and Service

Environment Policy

  • Strictly obey the legislations and regulations for pollution prevention.

  • Continually improve the processes for saving the resources usage.

  • Progressively manufacture the environment-protected products for the benefits of human society

Health and Safety Policy

  • Strictly obey the legislations and regulations for the employee health and safety.

  • Continually create the health and safety working environment.

  • Progressively prevent the potential risk of endangering the health and safety.


  • 100% visual inspection and electrical test

  • Test data

  • IPC

  • Certification - ISO 9001

  • XRF test data

  • Solderability test

  • Impedance modelling/testing

17. Hole counter
To check missing hole, hole size out spec., no excess holes
16. 100% O/S test
To checking circuit normal function as design circuit
13. Hole AOI
To check hole location compare with Gerber design location accurace
14. XRF measure Nickel & Gold thickness
To measuring surface finishing metal thickness
15. Hi-Pot test
To checking dielectric insulation capability
10. Impedance measurement
For measuring Impedance control products ( Single strip, Differential …)
11. Peel strength test
Testing Solder Mask adhesive
12. X-ray monitor multi layer drilling
It control inner and outer layer registration
4. Physical Laboratory
To do reliability test and outgoing inspection items
5. Micro-section
To analysis defects, every layer structure thickness, solder mask thickness, surface and PTH copper thickness
6. Black Light inspection
To analysis the PTH hole copper coverage before Panel copper plating
7. Lamination thickness measurement
To control the product thickness quality even distribution and thickness tolerance under control
8. L/S measurement control by 3D
To control the products after Pattern plating within the design spec. ( Line width and Space width)
9. CMI measure copper thickness
CMI help to measuring the PTH hole copper thickness and no need to damage the board by micro-section
3. Chemical analysis
Chemical analysis to control on line chemical solution within control range
In-process quality control, Every process on line sampling inspection
1. IQC
Incoming Quality Control for incoming raw material and Incoming Subcontract semi-products
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