Cofan PCB utilizes multiple vendors for its thermally conductive substrate materials at the Metal Core PCBs.  The materials we use allow us to build multi-layer boards with up to 8 oz of copper.  We offer concurrent engineering services, including thermal models and BOM analysis for optimal performance and cost effectiveness. Cofan can make the prototypes in 3~5 days with high-quality Surface Mount Assembly services.  Our level of service make us your one-stop shop for your MCPCB requirements.

Below are three thermal substrates that we have used in most of our applications:

• Bergquist
• Laird Technologies
• Gofang

Click on the links above to learn more about these thermal laminates and their characteristics.