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FR4 Capabilities

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General Capabilities

  • Single Sided
  • Double Sided
  • Multi Layer
  • Burried Via
  • Blind Via
  • Impedance Controlled
  • Micro Via
  • Laser Drilling
  • RoHS Compliance
  • Epoxy filled vias

Specific Capabilities

Attribute: see (*) below as applies S/Sided D/Sided Multilayer Advanced
Minimum Line/Spacing, Internal Layer N/A N/A .004Ħħ/.004Ħħ .003Ħħ/.003Ħħ
Minimum Line/Spacing, External Layer .007Ħħ/.008Ħħ .007Ħħ/.008Ħħ .005Ħħ/.005Ħħ .003Ħħ/.003Ħħ
Aspect Ratio (Thickness to Drill) 6:1 6:1 8:1 10:1
Minimum Drilled Hole Size .010Ħħ .008Ħħ .008Ħħ .008Ħħ
Land Size Internal (Diameter Over Drill) N/A N/A .015Ħħ .012Ħħ
Land size External (Diameter Over Drill) .012Ħħ .012Ħħ .012Ħħ .010Ħħ
Plane Clearance (Diameter Over Drill) .030Ħħ .030Ħħ .030Ħħ .024Ħħ
Plated Hole Tolerance +/- .003Ħħ +/- .003Ħħ +/- .003Ħħ +/- .002Ħħ
Minimum Dielectric Thickness N/A N/A .0025Ħħ .002Ħħ
Minimum Core Thickness N/A N/A .004Ħħ .003Ħħ
Minimum PCB Thickness ** .017Ħħ .018Ħħ .020Ħħ .020Ħħ
Maximum PCB Thickness .125Ħħ .125Ħħ .250Ħħ .250Ħħ
Thickness Tolerance (%) +/- 10 +/- 10 +/- 10 +/- 5
Maximum Board Dimensions * 16Ħħ x 52Ħħ * 19Ħħ x 22Ħħ * 17Ħħ x 23Ħħ * 17Ħħ x 23Ħħ *
Fabrication Tolerances (overall dimension) +/- .010Ħħ +/- .010Ħħ +/- .010Ħħ +/- .005Ħħ
Bow and Twist (Through Hole) % 1.5 1.5 1.5 1
Bow and Twist (SMT) % .75 .75 .75 .75
Minimum Conductor to Edge .015Ħħ .015Ħħ .015Ħħ .010Ħħ
Layer to Layer Registration Tolerance N/A .004Ħħ .004Ħħ .003Ħħ
Component Pitch .025Ħħ .025Ħħ .025Ħħ .015Ħħ
Soldermask Clearance .005Ħħ .005Ħħ .005Ħħ .004Ħħ
Soldermask Dams .005Ħħ .005Ħħ .005Ħħ .004Ħħ
Impedance Tolerance (>50 Ohms) % +/- 10 +/- 10 +/- 10 +/- 8
Maximum Layers 1 1 12 16
Minimum Copper Weight Inners (oz.) N/A N/A 1/4
Maximum Copper Weight Int. Ground (oz.) N/A N/A 3 8
Maximum Copper Weight Int. Signal (oz.) N/A N/A 2 6
Maximum Copper Weight Ext. Ground (oz.) 4 4 2 10
Maximum Copper Weight Ext. Signal (oz.) 4 4 3 10
For more information:
We Cofan is industry experts in Printed Circuit Board engineering provides best customer experience from PCB fabrication service to customer care. At each stage of order, we kindly acknowledge the best customer support is the key to success in satisfying our customer's expectations. Our engineering team located in North America and Asia are dedicated to provide top of the line manufacturing services of Printed Circuit Boards.
We believe in quality and Cost. And meeting the exact requirement and deadline of PCB production is our excellence. We are UL listed, RoHs certified and all buildings are ISO 9001:2008 certified. And we have many experience in production of Printed Circuit Boards used in various industries in many fields.
We offer competitive pricing for Single sided, Double sided and Multi-Layer production with Gold plating, PCB with gold finger, PCB with blind and buried holes, PCB for high frequency, PCB with impedance control, PCB with heavy cooper, ultra-thick PCB and Ultra-thin PCB.
Our quickturn service provides best customer experience for production of all possible forms of Printed Circuit Boards.
Our PCB assembly service targets both small and large volume customers with PCBs being delivered right on schedule to our valued customers.
In assembly of printed circuit boards, there are multiple step process which includes surface mount technology(SMT) and through hole technology. Through hole assembly processes includes placing the componenet onto the board and soldering leads via a wave soldering process. Some SMT components can be soldered by the wave soldering process while being placed on the bottom side of the board. In theh SMT process, while solder paste is deposited onto the connection pads of the PCB, components are placed onto those pads, reflowed in reflow furnace to melt the solder paste to form the mechanical and electrical connection of the component leads to the PCB. For in testing procedure, the assembled PCBs are placed into fixture that brings electrical power to the boards in order to make live functioning boards. This grop of active boards then is placed into ESS (environmental stress system chamber that cylcles between high and low temperature in number of cycles whether these stresses will appear failures in the assembled boards. The failures will be analyzed for cause.
Please Contact Cofan today. And let our dedicated team kindly support you.