Fabrication with Concurrent Engineering and Assembly / Integration Services
 

High Power LED, Power and Motion Control applications generate heat that often cannot be cooled through the traditional use of fans. Conduction cooling through the PC Board is often the only solution.  We help customers properly design their boards to eliminate prototype errors and get you the right aluminum core board or copper core board to accommodate your application needs.

This available cooling method often requires a shift in the way engineers typically design for heat dissipation. Instead of thermal energy leaving the source through the air, cooling is achieved through conductive measures. Cofan's MCPCB Concurrent Engineering Service helps engineers utilize the right thermal interface materials and components selection to withstand the temperature requirements, as well as keeping your application's performance at highest efficiency. Our Engineering Support team reduces the need for multiple prototyping, which can save substantial time and money.

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